KEY-207 Wafer Cutting Cleaning Agent

KEY-207 Wafer Cutting Cleaning Agent

Product Highlights

Compliant with RoHS and REACH environmental directives

Reduce friction and heat during the cutting process

Improve cutting precision

Extend the life of cutting tools

To prevent silicon wafers from cracking and splintering

Optimize waste management and maintain cleanliness


Scope of application

KEY-207 wafer dicing cleaning agent is suitable for cleaning various wafers, LEDs, silicon wafers, and ceramic substrates during the dicing process. It can be diluted with water at a ratio of 1:800~1000. During the recycling process, the original solution needs to be replenished periodically. After long-term recycling, the clear liquid on the top can be used again after settling.


Product Features

  • Possesses excellent cooling, lubricating, powder settling, and cleaning properties.

  • Effectively maintains smooth chip cutting edges and boundaries, preventing jagged or irregular cutting edges.

  • Significantly reduces water surface tension to prevent silicon powder adhesion.

  • Effectively prevents oxidation, discoloration, and corrosion of metal materials without affecting the luster of metal components on wafers.

  • Reduces issues like chipping, warping, and scratches, significantly improving product yield.

  • Contains no toxic or irritating materials, features a mild odor, and is an environmentally friendly product.


How to use

Mix KEY-207 wafer cutting cleaning agent and deionized water evenly to prepare a working solution with a mass ratio of 1:800~1000 deionized water. After a period of cleaning, the cleaning power will decrease due to the increase of residue in the cleaning agent, and the cleanliness of the cleaned parts will deteriorate. Depending on the actual use, the cleaning agent in the tank needs to be added or replaced regularly (depending on the number of parts to be cleaned).


Physicochemical Parameters

AppearanceLiquid
Density0.995±0.030 g/cm³ (20℃)
pH

7.00±2.00 

REACHPASS 
RoHSPASS 
Halogen content(ppm)ND


Packaging specifications

18L、20L、50L、100L、150L、200L、250L


Precautions

  • This product is a specialized cleaning agent that must be prepared with deionized water to form the working solution. The cleaning solution must not be mixed with other cleaning agents.

  • After opening the product and using a portion, the cap must be tightly secured to prevent the cleaning agent from evaporating.

  • Do not store used and unused cleaning agents in the same container. If any cleaning agent remains in the container after opening, do not leave it exposed to air; tighten the cap immediately.

  • Keep containers holding the cleaning agent clean to prevent contamination from dirt or other substances, which may affect the cleaning agent's quality.

  • Separation or cloudiness after prolonged storage is normal. Shake well before use for optimal results.

  • Ensure no cleaning agent residue remains on glass surfaces after rinsing.

  • After extended cleaning periods, adding the recommended defoamer will enhance foam suppression.


Transportation and storage  

Transport as non-hazardous chemicals and non-corrosive chemicals. 

Store in a cool, dry place away from light and heat, and in an airtight container. 

Shelf life is 12 months when sealed. 

Single packages must not be stacked more than two layers, and the bottom layer must be secured with a non-slip tray to prevent squeezing, deformation, or tipping.




Shenzhen Varmia Technology Co., Ltd.

Address: Building A, Da Wan Cultural Plaza, No. 4128 

Dongcheng Huan Road, Malan Subdistrict, Pingshan District, Shenzhen

Tel: 0755-27659820  

Fax: 0755-27659830

Mobile: 13302956659 (Mr. Wang)

Email: hmy-tech@163.com


Shenzhen Varmia Technology Co., Ltd. (Longgang Branch)

Address: 2nd Floor, Building 12, Anbo Technology Industrial Park, 

Baolong 4th Road, Baolong Avenue, Longgang District, Shenzhen

Tel: 0755-27659820

Fax: 0755-27659830

Mobile: 13392832759 (Ms. Jin)

Email: hmy_jinjing@yeah.net