
KEY-206 PCBA Cleaning Agent
Product Highlights
| RoHS PASS | Broad material compatibility | Safe, harmless, and biodegradable |
| High cleaning power | No residue after washing | Applicable to a variety of processes |
Scope of application
This product is excellent for cleaning flux and solder paste residues from PCBA circuit boards.
Product Features
Rapidly and effectively cleans flux residues and solder paste remnants from PCBA circuit boards.
Compatible with PCBs and components without adverse reactions.
Uses deionized water as solvent—non-flammable and safe for use, transport, and storage.
Completely halogen-free, compliant with RoHS and other environmental regulations.
Non-toxic to the environment and humans, biodegradable.
Wide process window with strong cleaning power, suitable for various cleaning methods, equipment, and processes.
Leaves no residue or whitening on cleaned surfaces.
Applicable processes
KEY-206
| Cleaning method | Cleaning agent | Rinse solution | Drying method |
| Spraying | KEY-206 | Deionized water | Hot air drying or oven baking |
| Ultrasound | KEY-206 | Deionized water | Hot air drying or oven baking |
| Hand wash | KEY-206 | Deionized water | Hot air drying or oven baking |
Remark:
Product properties at 25°C, excluding boiling point and freezing point.
How to use
Cleaning is typically performed using ultrasonic or spray methods, with a small portion requiring manual brushing.
The entire automated inline cleaning process takes 5 to 30 minutes, with specific durations adjustable based on product requirements.
The optimal temperature for cleaning and rinsing solutions is maintained between 50–60°C. Hot air and baking temperatures range from 80–110°C, with specific settings adjusted according to product requirements. Ensure all residual moisture on PCBA is completely evaporated.
After a period of operation, residue accumulation in the cleaning solution reduces cleaning efficacy and compromises PCBA cleanliness. Regular replenishment or replacement of the cleaning solution is required based on actual usage. For automatic inline cleaning, this is recommended every 3–7 working days; for offline ultrasonic cleaning, every 2–4 hours (depending on the quantity of PCBA being cleaned).
After a period of rinsing, cleaning agent concentration in the rinse solution increases, diminishing PCBA cleanliness. Rinse solutions should be replaced regularly based on actual usage. At minimum, ensure rinse solutions are replaced after 2–4 hours of rinsing across 3 rinse tanks. (Depending on the quantity of PCBA being cleaned).
Physicochemical Parameters
| Appearance | Clear or pale yellow liquid |
| Category | Semi-aqueous cleaning agent |
| Density | 1.005±0.020 g/cm³ (20℃ |
| pH | 11.50±1.50 |
| Cleaning temperature | 30.0~60.0 ℃ |
| Flammability | Non-flammable |
Packaging specifications
18L、20L、50L、100L、150L、200L、250L
Precautions
After opening this product and removing the portion for use, the lid must be tightly secured to prevent the cleaning agent from evaporating.
Used cleaning agent must not be stored in the same container as unused cleaning agent. Once opened, if any cleaning agent remains in the container, it must not be left exposed to air; the lid should be tightly screwed on promptly.
Keep containers holding cleaning agent clean to prevent contamination from dirt or other substances, which may compromise the cleaning agent's quality.
Before cleaning PCBA boards, test the cleaning agent's solubility on PCB and component silkscreen printing and solder mask.
After rinsing, ensure no cleaning agent residue remains on the PCBA board surface or components.
After baking, ensure no cleaning agent or deionized water residue remains on the PCBA surface or components.
After continuous cleaning for an extended period, it is recommended to add an appropriate amount of compatible defoamer for enhanced foam suppression.
Transportation and storage
Transport as non-hazardous, non-corrosive chemicals.
Store away from light and heat in sealed containers.
Shelf life is 12 months when sealed.
Individual packages may be stacked no higher than two layers. The bottom layer must be secured with non-slip pallets to prevent crushing, deformation, or tipping.
Shenzhen Varmia Technology Co., Ltd.
Address: Building A, Da Wan Cultural Plaza, No. 4128
Dongcheng Huan Road, Malan Subdistrict, Pingshan District, Shenzhen
Tel: 0755-27659820
Fax: 0755-27659830
Mobile: 13302956659 (Mr. Wang)
Email: hmy-tech@163.com
Shenzhen Varmia Technology Co., Ltd. (Longgang Branch)
Address: 2nd Floor, Building 12, Anbo Technology Industrial Park,
Baolong 4th Road, Baolong Avenue, Longgang District, Shenzhen
Tel: 0755-27659820
Fax: 0755-27659830
Mobile: 13392832759 (Ms. Jin)
Email: hmy_jinjing@yeah.net
Copyright @ 2018 ShenZehn Varmia Technology Co.,Ltd Te:0755-27659820 Fax:0755-27659830
Address: Building A, Dawan Culture Plaza, No. 4128 Dongcheng Ring Road, Mawei Street, Pingshan District, Shenzhen Mailbox:hmy-tech@163.com